Abstract
Integration of electronic components and internet connectivity into devices is becoming commonplace. Flexible circuitry allows for integration without significantly altering the dimensions of these devices. Here we demonstrate the combined use of UV-laser exposure activation of a photopatternable catalytic resist deposited onto flexible glass and polyimide substrates. Metals are selectively plated onto the UV-laser activated portions of the resist. This relatively simple approach, developed by Nano3D Systems, obviates the need for physical vapor deposition, photolithography, and lift-off techniques that are normally used for fabrication of circuitry on flexible substrates.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
