Selective growth of TiO2 thin films on Si(100) surfaces by combination of metalorganic chemical vapor deposition and microcontact printing methods

Abstract

We successfully patterned TiO2 thin films by metalorganic chemical vapor deposition (MOCVD) on Si(100) substrates where the surface was first modified by an organic thin film. The organic thin film [octadecyltrichlorosilane (OTS)] of self-assembled monolayers (SAMs) was deposited by microcontact printing. Selective deposition of a 130 nm thick TiO2 film was done on a 300–500 °C surface prepared by MOCVD without any carrier or bubbler gas. Auger electron spectroscopy and x-ray diffraction analyses showed that the deposited TiO2 material was stoichiometric, polycrystalline, and consisted of anatase phase. Alpha-step profile and optical-microscopic images also showed that the boundaries between the OTS SAMs and selectively deposited TiO2 thin film areas are definite and sharp. Capacitance–voltage measurement of a TiO2 thin film yielded a dielectric constant of 29, suggesting possible application to electronic materials.