Abstract
Differential scanning calorimetry studies of the reaction of a cyclolinear polycarbosilane [cyclo-(CH3Si(CH2)2SiCH3)-(CH2)6]n on air-exposed Cu surfaces reveal a substantial enhancement of the cross-linking rate compared to noncatalytic surfaces, e.g., Au, Ag, Al, Si. The increased rate is attributed to surface Cu(II)-catalyzed opening of the embedded disilacyclobutane rings in the polymer. This rate enhancement is used to selectively deposit a cross-linked polycarbosilane on copper patterns in exclusion to the silicon substrate surface. These results could be attractive for realizing metal-dielectric interfaces for applications in nanodevice wiring and packaging.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
