Abstract
Two IC-process-compatible fabrication schemes, based on the selective and non-selective deposition of a thick polysilicon layer in an epitaxial reactor, are used for adaptive micromirror device fabrication. The micromirror consists of a composite diaphragm (a square-shaped silicon nitride membrane on which an additional thick polycrystalline silicon layer with a circular aperture is formed) coated with a reflective aluminium layer on a bulk micromachined 10.5 mm by 10.5 mm square silicon frame. The additional polycrystalline silicon layer with a circular aperture improves the optical properties of a deflected square-shaped silicon nitride membrane resulting from anisotropic KOH etching.
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