Abstract
Springback is a geometrical defect that occurs due to the removal of the bending force acting on the component the end of the forming process. In the present study, springback behavior of Ti-Grade 2 sheets is studied by finite element method and experimentation. The process parameters considered are punch radius, die opening and sheet thickness. Based on Taguchi (L9) Orthogonal array, the simulation and experiments were conducted. Simulated springback values were found to be in good agreement with experimental values. Signal-to-noise (S/N) ratio is used to determine the optimal combination of parameters that minimizes springback. Analysis of variance is employed to study the influence of process parameter on springback.
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