Abstract
A comparative study of cathodic and anodic processes during the electrolysis of tantalum containing chloride and chloride-fluoride melts is presented. The substitution of chloride ions by fluoride ions in the ligand shells of Ta(IV) and Ta(V) species is proposed as the basis for a mechanism for the formation of sludge and the outgrowth of films from the electrode over the surface of the electrolyte during tantalum electrodeposition employing a soluble anode configuration.
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