Abstract
In the second transfer process, electrostatic forces, caused by the transfer electric field, act on a sheet in the nipped region. As a result, the sheet sticks to the roller, and sheet transportation fails. We have developed a numerical simulation method of sheet transportation in the second transfer process. The method calculates sheet transportation by means of weak-coupling between electric field analysis and structural analysis, and which considers electrostatic forces acting on the sheet and displacement of components relative to each other. We used the method to calculate sheet transportation in a system that consists of two rollers and the sheet between them. In this system, the sheet passes between two rollers which contact each other and to which a voltage is applied. The calculated charge density and sheet displacement showed good agreement with experiments. Another analysis clarified the relationship between electric discharges in the nipped region and sheet sticking to the roller.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
