Abstract
This paper discusses the second generation liquid source misted chemical deposition (LSMCD) technology currently being developed for ferroelectric thin film deposition. A SubMicron Systems (SMS) Model Primaxx-2F cluster tool was used to deposit the films. The developments that have been made since the first generation machine are discussed. The process chamber schematics along with the characteristics of the aerosol generator are explained in detail. The electrical properties obtained from the films deposited by the tool are found to be similar to that of spin-on films. The step coverage obtained on patterned wafers are also shown. The LSMCD technique combines the advantages of spin-on such as simplicity, good stoichiometry control and superior electrical properties with the advantages of CVD such as superior step coverage, manufacturability, etc.
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