Abstract
In the last few years hybrid silicon pixel detectors came to use in high energy physics. One of the most serious problems is the realization of detectors and read out electronics interconnection at high density and low cost. For the upgrade in the forward direction of the DELPHI silicon vertex detector, it has been successfully carried out the bonding of pixel detectors to VLSI read out chips by means of conductive glue screen printing followed by a precise chip flipping procedure. The measured missing contact rate is (0.05±0.03)%.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
