Abstract
Abstract In silicon solar cells, forming good ohmic contact between the emitter and the metal with minimum contact resistance is critical to achieve peak electrical performance [1] . In commercial solar cells, screen printable silver paste is commonly used to form contact. Factors related to paste chemistry, process conditions and the solar cell wafers influence the contact quality. In this paper, the effect of paste chemistry and emitter sheet resistance on contact quality is described. Several paste chemistries were tested for contact resistance with Transmission Line Model (TLM) measurements on wafers with sheet resistance between 45-100 Ω/□. The series resistance of the solar cells was recorded over 50 °C firing window. The paste chemistry was further refined to form low resistance contacts on solar cells with emitter sheet resistance on 100 Ω/□.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
