SCF-NiFe2O4/epoxy composites with high thermal conductivity and electromagnetic interference resistance

Abstract

With the development of electronic components towards high power, high packaging density, and miniaturization of device size, heat dissipation and the electromagnetic interference problems between the electronic components are emerging. In order to solve the undesirable electromagnetic wave and heat emissions produced by electronic device simultaneously, the electronic packaging materials with high thermal conductivity and anti-electromagnetic interference are highly expected. In this work, NiFe2O4-modified short carbon fibers (SCF) were designed and prepared. NiFe2O4 were in situ grown on the surface of SCF by hydrothermal method. The chemical structure and morphology of SCF-NiFe2O4 were characterized by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The microwave absorbing performance test shows that SCF-NiFe2O4 possess superior microwave absorbing performance, where the minimum reflection loss is − 20.7 dB. Finally, SCF-NiFe2O4/epoxy resin composites were prepared by introducing SCF-NiFe2O4 as thermal conductive filler into epoxy resin. The surface-modified SCF with NiFe2O4 is more easily infiltrated by resin and exhibits strong interfacial interaction with the matrix. With the increase of the content of SCF-NiFe2O4, the thermal conductivity of the composites increases obviously. When the content of SCF-NiFe2O4 reaches 20 vol%, the composites show better thermal conductivity, and the thermal conductivity reaches 1.03 W/m K.