Scatterometric analysis of chatter marks occurring in industrial grinding processes

Abstract

Grinding processes often underlie chattering which results in a wavy surface of the ground metal sheet. In this work it will be shown that the angle resolved light scattering method is not only suitable to monitor industrial grinding processes, in both waviness and roughness modes, but also enables the determination of the waviness of a ground surface. Furthermore it is demonstrated that the roughness, e.g. the average roughness R a and roughness depth R z , of a ground surface directly depends on the grinding pressure. The light scattering value A q correlates with the roughness values obtained with a stylus probe system. In this way it is proven that the light scattering system unambiguously determines chatter marks and the roughness of a metal sheet during a grinding process.