Abstract
The characterization of connector failures by scanning electron microscopy/energy dispersive X-ray (SEM/EDX) is described. The advantages of SEM/EDX over optical inspection are discussed. Three types of failures are covered: (1) migration of base metal to the surface, leading to corrosion at the contact area; and (2) fretting corrosion; (3) microcracking at the surface or at a barrier layer, exposing the base metal. >
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
