Scaling behavior and morphological properties of the interfaces obtained by the multilayer deposition process

Abstract

The aim of the present work was to study numerically the scaling behavior and the morphological properties of the interfaces generated by the multilayer deposition process. We have noticed that, in the case where the ratio of the surface diffusion coefficient to the deposition rate reaches high values D/F>>1, the interface consists of mound structures. By using the dynamic scaling, we have shown that the height–height correlation function scales with time t and length l as G(l,t)~lαf(t/lα/β) with β=0.25±0.05 and α=0.51±0.02. These exponent values are equal to the ones predicted by the Edwards–Wilkinson approach. Besides, our results are in agreement with the growth system of Cu/Cu(100) at 300K which has been characterized in more detail by a combined scanning tunneling microscopy and spot profile analysis — low energy electronic diffusion study. Moreover, by considering two different methods, we have examined the fractal aspect of the obtained interfaces.