Abstract

Rapid advances in microelectromechanical systems have stimulated the development of compact devices, which require effective cooling technologies (e.g., microchannel cooling). However, the inconsistencies between experimental and classical theoretical predictions for the liquid flow in microchannel remain unclarified. Given the larger surface/volume ratio of microchannel, the surface effects increase as channel scale decreases. Here we show the scale effect of the boundary condition at the solid–liquid interface on single-phase convective heat transfer characteristics in microchannels. We demonstrate that the deviation from classical theory with a reduction in hydraulic diameters is due to the breakdown of the continuum solid–liquid boundary condition. The forced convective heat transfer characteristics of single-phase laminar flow in a parallel-plate microchannel are investigated. Using the theoretical Poiseuille and Nusselt numbers derived under the slip boundary condition at the solid–liquid interface, we estimate the slip length and thermal slip length at the interface.

Highlights

  • We demonstrate that the deviation from classical theory with a reduction in hydraulic diameters is due to the breakdown of the continuum solid–liquid boundary condition

  • We studied the scale effect of the boundary condition at the solid–liquid interface on the single-phase convective heat transfer characteristics in microchannel or nanochannel flow

  • We have shown that the increasing inaccuracy of the predictions of classical theory with a decrease in the hydraulic diameter is due to the breakdown of the continuum solid–liquid boundary condition in microchannels

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Summary

Parallel plates

The thermal slip length (i.e., the Kapitza length). In addition, the convective heat transfer characteristics of single-phase laminar flow in parallel-plate microchannels are investigated experimentally. Using the theoretical Po and Nu numbers derived under the slip boundary condition at the solid–liquid interface, we estimate the slip length and thermal slip length at the interface

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