Abstract
Plastically relaxed GeSi films with a fraction of Ge ranging from 0.19 to 0.29 are grown on Si(0 0 1) substrates with the use of a low-temperature (350 °C) buffer layer of Si. Their root mean square (RMS) surface roughness is in the 1.7–2.7 nm range. Addition of Sb as a surfactant smoothing the surface of the stressed film during its growth is shown to reduce the surface roughness of the plastically relaxed heterostructure. The RMS roughness lower than 1 nm is reached for a film with a 0.29 fraction of Ge and a threading dislocation density close to 10 6 cm −2.
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