SAW strain sensors - high precision strain sensitivity investigation on chip-level

Abstract

This paper presents a strain and stress sensitivity investigation of surface acoustic wave (SAW) strain sensors on chip-level. Longitudinal and transversal orientated SAW strain sensors are homogeneously loaded. The sensors response is measured and analyzed with a network analyzer while the sensor substrate stripes are strained precisely. An optical 3D deformation analysis system is used for reference strain measurements. The determined strain on chip-level is compared with strain calculations. High precision strain and stress sensitivities are presented without the cross effects of multilayer measurement setups.