Sample Preparation in Recover Physical Defects on MIM Related failure for Different Devices In Wafer Fabrication

Abstract

In wafer fabrication, sample preparation is becoming increasingly challenging as IC devices evolve to smaller feature sizes and higher densities. [1] Thus, the task of performing successful failure analysis (FA) is more challenging and difficult. Sample preparation is a key activity in material and failure analysis. In semiconductor, there are many different devices, process and design according to the customer requirement. Different FA approach for different devices and failure mode plays a very important role to help identify the root cause of the failure. This paper discusses the techniques used to ensure samples are kept in the best possible condition for the failure analyst. Also, we will discussed in-depth device study and the beauty of good sample preparation methodology through mechanical/chemical parallel polishing or etching together with correct FA approach or methodology to ensure good success rate in identifying failure on MIM breakdown. Two case studies will be discussed here to demonstrate how to identify the physical defect on Cu and Al process on MIM issue.