Abstract
The interactions of medical implants in the human body with electromagnetic fields from newly introduced high-field technologies such as near-field wireless power transfer (WPT) are of great concern. In this study, the effects of implants on the specific absorption rate (SAR) in a head model were computationally evaluated in the immediate vicinity of a WPT system operating at 6.78 MHz with a transferred power of 50 W. The SAR in the head model located 30 mm above the WPT system was evaluated with a skull plate, bone plates (different shapes), miniplate, fixtures, and a deep brain stimulator. The results indicated that even small implants had notable effects on the SAR distribution and corresponding local peak and mass-averaged SAR values. Apart from the size and shape of the implant, the crucial factor influencing the SAR was the implant’s position with respect to the WPT system. Therefore, various position configurations were simulated for the WPT system to determine the worst case scenario for each specific implant. Although the local peak SAR value was increased by a factor of 600 in the worst-case scenario (for the skull plate), the SAR <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$_{\text{1}g}$</tex-math></inline-formula> and SAR <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$_{\text{10}g}$</tex-math></inline-formula> were only increased by factors of seven and four, respectively. Compliance with international safety limits was studied, followed by computing the maximum allowable transmit power (MATP). It was found that, without the implant, the MATP satisfying SAR <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$_{\text{1}g}$</tex-math></inline-formula> was 43 W for the designed WPT system, and was reduced to 6.9 W in the presence of the skull plate.
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More From: IEEE Transactions on Electromagnetic Compatibility
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