Abstract
Authors have been developed a novel double-sided polishing machine with high efficiency for IT devices. This machine consists of upper, lower platens and a pallet for work pieces. It has a new mechanism for high efficiency using circular moving each other parts. This machine has two major features. Firstly, the production efficiency obtained three times and more than the similar polishing area machine. Because this machine has no rotating center-shaft, the polishing area becomes larger than conventional polishing machine. Secondly, the high polishing rate is obtained using the water based with CeO_2 abrasives under AC. electric field.
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