RVS WFIRST sensor chip assembly development results

Abstract

Raytheon Vision Systems (RVS) has been developing high performance low background VisSWIR focal plane arrays suitable for the NASA WFIRST mission. These near infrared sensor chip assemblies (SCAs) are manufactured using HgCdTe on CdZnTe substrates with a 10 micron pixel pitch. WFIRST requirements are for a 4k x 4K format 4-side buttable package to populate a large scale 6 x 3 mosaic focal plane array of 18 SCAs. RVS devices will be compatible with the NASA developed FPA 4-side buttable package, and flight interface electronics. Initial development efforts at RVS have focused on a 2k x 2k format 10 micron pixel design based on an existing readout integrated circuit (ROIC) to demonstrate desired detector material performance at a relevant scale. This paper will provide performance results on the RVS efforts. RVS has successfully developed multiple 4k x 4k 10 micron pixel ROICs and we plan to demonstrate readiness to scale our design efforts to the desired 4k x 4k format for WFIRST in 2016.