Abstract

The roughening kinetics of copper films synthesized by low pressure chemical vapor deposition (LPCVD) on Si(100) substrates was investigated by scanning tunneling microscopy (STM). By applying the dynamic scaling theory to the STM images, a steady growth roughness exponent α=0.81±0.05 and a dynamic growth roughness exponent β=0.62±0.09 were determined. The value of α is consistent with growth model predictions incorporating surface diffusion. The value of β, while higher than expected from these models, can be related to LPCVD processing conditions favoring growth instabilities.

Highlights

  • Aluminum films have commonly been used in the metallization of integrated circuit devices

  • Copper is a suitable alternative choice because of its low bulk electrical resistivity ~1.67 versus 2.65 mV cm for Al! and its superior electromigration resistance which would allow higher current densities to be sustained on smaller linewidths as well as minimize the RC delay time of the circuit

  • Recent studies have focused on the use of ~trimethylvinylsilyl! hexafluoroacetylacetonato copper I @~hfac! Cu~I! TMSV# as a precursor for the deposition of LPCVD Cu films at relatively low temperatures and high growth rates

Read more

Summary

Introduction

Aluminum films have commonly been used in the metallization of integrated circuit devices. TMSV# as a precursor for the deposition of LPCVD Cu films at relatively low temperatures and high growth rates. Imaging of Cu films grown by LPCVD from ~hfac!

Results
Conclusion
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.