Abstract
Gate SiO2 films in poly-Si TFTs were fabricated by sputtering at substrate temperature from 300°C down to room-temperature. It was found that poly-Si TFT characteristics of mobility, threshold voltage and subthreshold slope were greatly improved by decreasing substrate temperature. Mobility of the poly-Si TFT for room-temperature was 90 cm2/V.s, much higher than 50 cm2/V.s for 300°C. Moreover, sputtered gate SiO2 poly-Si TFTs showed high reliability against hot carrier effect even for room-temperature-deposition.
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