Abstract
The Aerosol Deposition (AD) process will be proposed as a new fabrication technology for the integrated RF modules. α-Al₂O₃ thick films were successfully grown on glass and Al substrates at room temperature by the AD process. Relative dielectric permittivity and loss tangent of the Al₂O₃ thick films on Al showed 9.5 and 0.005, respectively. To form microstrip lines on aerosol-deposited Al₂O₃ thick films, copper electroplating and lithography processes were employed, and the square-type cross section with sharp edges could be obtained. Low-pass LC filters with 10 GHz cutoff frequency were simulated by an electromagnetic analysis, exhibiting the validity of the AD process as a fabrication technology for integrated RF modules.
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