Room temperature migration of ion beam injected point defects in crystalline silicon

Abstract

We have investigated the room temperature diffusion and trapping phenomena of ion beam generated point defects in crystalline Si by monitoring their interaction with dopants, native contaminants such as C and O, and other defects. Spreading resistance measurements show that a small fraction (∼ 10 −7–10 −6) of the defects generated at the surface by a 40 keV Si implant is injected into the bulk. These defects undergo trap-limited diffusion and produce dopant deactivation and/or partial annihilation of preexisting deep (several micron) defect markers, produced by MeV He implants. It is found that in highly pure, epitaxial Si layers, these effects extend to several microns from the surface, demonstrating a long range migration of point defects at room temperature. A detailed analysis of the experimental evidences allows us to identify the Si self-interstitials injected into the bulk as the major responsible of both dopant deactivation and partial annealing of vacancy-type defects (divacancies, phosphorus-vacancy and oxygen-vacancy) generated by the implants. Finally, a lower limit of ∼ 6 × 10 −11 cm 2/s is obtained for the room temperature diffusivity of Si self-interstitials.