Room temperature grain growth in electroplated copper thin films

Abstract

The microstructural changes in copper thin films at room temperature after electrolytic deposition have been studied by X-ray diffraction, wafer curvature stress measurement, electrical resistance measurement, and local orientation mapping. Changes in texture and stress were found to take place earlier than grain growth became distinctly visible. Additionally, FIB cross sections showed the evolution of grains in third dimension. The results are discussed in terms of grain growth from the bottom to the top of the film.