Abstract
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating low cost and high scalability. We have shown low-loss SiN waveguides, high-Q ring resonators, critically coupled ring resonators, 50/50 beam splitters, Mach-Zehnder interferometers (MZIs) and a process-agnostic fiber packaging scheme. We have further explored the utility of this process for applications in nonlinear optics and quantum photonics. We demonstrate spectral tailoring and octave-spanning supercontinuum generation as well as the integration of superconducting nanowire single photon detectors with MZIs and channel-dropping filters. The packaging approach is suitable for operation up to 160 °C as well as below 1 K. The process is well suited for augmentation of existing foundry capabilities or as a stand-alone process.
Highlights
The first on-chip photonic components were developed in the mid-1980s, and the subsequent three decades have demonstrated exponential growth in the data capacity per die [1] due to the miniaturization enabled by integrated photonic devices
We have demonstrated low-loss passive SiN waveguides and resonators, critically coupled rings, and Mach-Zehnder interferometers (MZIs), dispersion-engineered waveguides and waveguide-device-integrated WSi superconducting-nanowire single-photon detectors (SNSPDs)
We have presented an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature
Summary
The first on-chip photonic components were developed in the mid-1980s, and the subsequent three decades have demonstrated exponential growth in the data capacity per die [1] due to the miniaturization enabled by integrated photonic devices. For superconducting optoelectronic networks [21] and quantum-optical applications, high detection efficiency is required, and superconducting detectors are a very desirable option [22] Such detectors are not likely to be incorporated into a foundry process in the near term. The dielectrics are deposited using plasma-enhanced chemical vapor deposition (PECVD), and the superconductors are deposited with sputtering Such deposition techniques are compatible with BEOL processing, so these process modules and photonic devices can be straightforwardly integrated with fully processed wafers from other foundries. Room temperature deposited materials [24] are even more broadly compatible With this fabrication process, we have demonstrated low-loss passive SiN waveguides and resonators, critically coupled rings, and Mach-Zehnder interferometers (MZIs), dispersion-engineered waveguides and waveguide-device-integrated WSi superconducting-nanowire single-photon detectors (SNSPDs)
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