Abstract
In this study we established a new process of the bonding and debonidng of the glasses for the handling of the ultra thin glass substrates. On the basis of the Surface Activated Bonding (SAB) method, the glasses were bonded using the Si and Fe intermediate layers at room temperature. The bond strength was evaluated before and after heating at 450°C, and the results showed the bond strength can be controllable by the bonding conditions such as the Si deposition, the ion beam irradiation and the bonding ambience. Additionally, the SAM images and the XPS analyses indicated that the voids in the bonding interfaces affected on the easy lift-off process without the residue on the glass surfaces. The proposed method would be an alternative of the temporary bonding method of the glasses in the fabrication process of the display devices.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
