Abstract

The effects of sputtering power on the deposition rate as well as the microstructural, electrical, and optical properties of indium tin oxide (ITO) thin films are investigated in this paper. ITO thin films were deposited on glass substrates using direct current (DC) magnetron sputtering of different DC powers, ranging from 60 to 140 W, onto externally unheated glass substrates. All samples were grown at the minimum sustainable plasma pressure to reduce the destructive role of pressure. The microstructural, electrical, and optical properties of the sputtered ITO films were systematically characterized by X‐ray diffraction (XRD), atomic force microscopy (AFM), four‐probe electrical conductivity, and optical spectroscopy. XRD studies confirmed the cubic bixbyite ITO structure, and the main preferred orientations of the prepared thin films were (222), (400), (440), and (622). AFM analysis showed a minimum surface roughness of 1.37 nm for the films deposited at 140 W, while the average size of the grains was 65 ± 5 nm. The deposition time was fixed at 10 min for all samples, and the AFM characterization of the films showed 170, 230, and 250 nm thickness for the samples deposited at 60, 100 and 140 W, respectively. From the variations of the sheet resistance and the XRD patterns of the ITO thin films, it was concluded that, as the ratio I222/I400 of a sample approaches unity, the sheet resistance of the layer reduces. A minimum sheet resistance 16 Ω/square, transmittance 85% with the thickness of 230 nm, and optical bandgap 4.09 eV were found for the thin film grown on the externally unheated substrates at 100 W DC power and 32 mTorr working pressure. © 2017 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

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