Role of sacrificing layer on glasses during ultrasonic machining (USM) - a review

Abstract

Ultrasonic machining is a non-traditional, non-thermal material removal method; used to fabricate channels and drill holes in brittle materials such as glasses and wafers by using customized tools and ultrasonic vibrations. In this paper, different types of ultrasonic machining processes (Rotary, Stationary, Hybrid, and Micro) along with its process (Feed Rate, Tool Rotation Speed, Amplitude, Frequency, and Ultrasonic Power) and performance (MRR, Surface Roughness, Overcut, Edge Chipping, and Tool Wear) parameters have been studied. The role of sacrificing layers on glasses and silicon wafers during ultrasonic machining and their effect on various performance parameters have been extensively reviewed in this article. This article also presents a comprehensive and chronological review of ultrasonic machining and possible process and performance parameters on the wide variety of brittle materials extensively in different types of glasses used by various researchers. This provides optimized input and output parameters for their machining. In conclusion, MRR has been found directly proportional to Feed Rate, Tool Rotation Speed, and Ultrasonic Power. Surface Roughness has been observed to increase with the increase in Feed Rate and decrease in Tool Rotation Speed and Ultrasonic Power. Edge Chipping has been observed to be directly proportional to Feed Rate, Tool Rotation Speed and inversely proportional to Ultrasonic Power. It is also concluded that by incorporating Sacrificing Layer, overcut is decreased and the overall surface finish is increased. The objective of this paper is to study the significance of sacrificing layers and to provide optimized process parameters for ultrasonic machining of different glass types.