Abstract
Good wetting, strong bonding and low electrical resistance are the most important properties of the solder in microelectronic packaging. Aim of this study was to improve the mechanical and wetting properties of commercially available lead-free solders. Different type and sized ceramic particles treated with different surface modification methods were added to lead-free SAC305 solder paste to form composites. The reinforcement particles were subjected to various surface modification processes. We made reflow soldering in the same way as in industrial application. Solder joints were formed between a novel designed test PCB board and microelectronic components. The mechanical properties of the composite joint were tested by microhardness measurement and shear test, while the microstructure and the IML layer were examined by scanning electron microscope.
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