Abstract
The kinetics of dissolved O 2 reduction and hydrogen evolution reactions on copper surface was studied in naturally aerated and air and O 2-saturated 0.50 mol/L H 2SO 4 solutions using polarization measurements combined with the rotating disc electrode (RDE). The Koutecky–Levich plot indicated that the dissolved O 2 reduction at the copper electrode was an apparent four-electron process. A correlation between the presence of dissolved O 2 and the formation of Cu 2O, confirmed from XRD, was discussed. Ascorbic acid (AA) was tested as a safe inhibitor for copper corrosion in H 2SO 4 solutions at 25 °C. Measurements were carried out as a function of dissolved oxygen concentration using Tafel polarization measurements. The addition of AA slowed down the reduction reaction of dissolved O 2 more effectively than the anodic reaction. Dissolved O 2 was found to enhance the inhibition performance of AA. Adsorption via hydrogen bonding was considered.
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