Abstract
Corrosion rates of copper single crystal faces are determined in stirred 0·1N sulphuric acid with various chloride ion concentrations. A mechanism is proposed to explain the variation of corrosion rate with Cl− ion concentration. Up to 7·5 × 10−3 M Cl− ions, the stabilities of the crystal faces are in the order (111)>(100)>(110) but this order is changed to (110)>(100)>(111) in presence of 10−2 M Cl− ions. The corrosion potentials of the crystal faces are less noble at all concentrations of Cl− ions and Cl− ion acts as a cathodic inhibitor. There is no significant orientation effect on the kinetics of dissolution of copper.
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