Role of Amine and Carboxyl Functional Groups of Complexing Agents in Slurries for Chemical Mechanical Polishing of Copper

Abstract

The effects of complexing agents with carboxylic and/or amine functional groups on the dissolution and polishing of copper in the presence of were investigated as a function of pH. For this purpose, copper coupons were immersed in solutions of acetic acid, glycine, or ethylenediamine containing , and the loss of weight was determined gravimetrically. Analogous experiments were also carried out using copper oxide powders. The obtained results were then compared with polish rates of copper using slurries, containing silica as abrasives, in otherwise the same experimental conditions. While both sets of results were quite sensitive to the complexing agents used at different pH values, excellent correlation in trends was established between dissolution and polish rates.