Abstract
This paper presents a strategy for improving reliability by using a robust design method. In this approach, reliability is related to performance degradation and several reliability models are developed to address performance degradation. This robust design strategy integrates orthogonal array experiments with environmental stress testing. Its goal is to select optimal levels of design parameters such that the product performance will be less sensitive to environmental stresses and thus more reliable. This method is applied to the design of an IC wire-bonding process and a comparison shows that the products produced with optimum design parameters are more robust and reliable under environmental stresses. Copyright © 1998 John Wiley & Sons, Ltd.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
