Rice Husk‐derived Hierarchical Micro/Mesoporous Carbon–Silica Nanocomposite as Superior Filler for Green Electronic Packaging Material

Abstract

In this study, a carbon‐controllable hierarchical micro/mesoporous carbon–silica material derived from agricultural waste rice husk was easily synthesized and utilized as filler in an epoxy matrix for electronic packaging applications. Scanning electron microscopy, thermogravimetric analysis, and N2 adsorption/desorption isotherms were used to characterize the morphology, thermal stability, carbon content, and porous structural properties, respectively, of the as‐obtained carbon–silica material, namely rice husk char (RHC). As a filler material, the uniformly dispersed RHC filler in the epoxy/RHC composite was easily prepared through hydrogen bonding of the silanol group of silica with the epoxy matrix. For electronic packaging applications, the thermal conductivity and thermomechanical properties (storage modulus and coefficient of thermal expansion) of the epoxy/RHC composites improved with increasing carbon content. Moreover, loading of the 40% RHC filler substantially enhanced the storage modulus of the epoxy/RHC composite (5735 MPa) compared to the epoxy with 40% commercial silica filler (3681 MPa). Considerable commercial potential is expected for the carbon–silica composite because of the simple synthesis process and outstanding performance of the prepared packaging material.