Abstract
ABSTRACT Rheological properties of a solder paste containing a lead-free solder powder (Sn-Zn-Bi alloy) uncoated and coated with wax powder (12-hydroxystearic acid) was investigated. Measurement of the rheology of solder pastes with the region of high strain rate within the possible limits was conducted using a capillary rheometer. During the mechanical dry particle coating process under the appropriate operating conditions, coated particles have been maintained spherical shape. Viscosity of solder paste containing deformed particles became higher than that of a solder paste containing spherical particle before deformation. With 0.33 of strain, the viscosity increases 2 to 3 times higher than that for 0.1. Using the coated particle, the viscosity of solder paste was close to that of solder paste containing original solder particles, when the concentration of the guest particle was about 0.9 wt.% which is to be considered as optimum concentration of guest particles.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
