Abstract
In this work, we have studied, formulated, prepared, and characterized the rheological and electrical behavior of a composite material based on an epoxy resin Diglycidyl Ether of Bisphenol A (DGEBA) reinforced with hexaglycidyl cyclotriphosphazene (HGCP). The epoxy system was cured with 4,4’-methylene dianiline (MDA). DGEBA-HGCP-MDA epoxy composite materials with reinforced HGCP which varied from 5% to 10% by weight were prepared by mixing in the molten state. The morphology was evaluated by SEM. The rheological behavior was studied using small deformation rheology. The electrical characterization was carried out with a frequency variation range from 1 Hz to 100 KHz at room temperature. These measurements revealed that the rheological and electrical behaviors strongly depend on the quantity of HGCP in the DGEBA matrix. The linear viscoelastic properties study reveals that the modulus of elasticity G’ is dependent on the amount of HGCP present in the epoxy resin DGEBA. The capacitance-frequency measurements suggest a distribution of localized states in the band gap of the blends.
Highlights
While hexaglycidyl of cyclotriphosphazene (HGCP) had good dispersion in Diglycidyl Ether of Bisphenol A (DGEBA) epoxy resin, the study will focus on the effect of HGCP in the physical behavior of materials based on DGEBA epoxy resin
The result indicates that the introduction of HGCP into the DGEBA resin makes the samples more flexible. This increased flexibility of the samples can be attributed to the free volume presented by the HGCP / methylene dianiline (MDA) / DGEBA network, promote molecular into the DGEBA resin and the modulus of elasticity by a factor of 2 which can be attributed to the increase in knots in the matrix
Capacity-frequencycharacteristics characteristics for of of Various composite materials based on the epoxy resin DGEBA, MDA as hardener and the epoxy
Summary
Epoxy resins are thermosetting polymers that have been extensively employed in various areas such as aerospace, coatings, adhesives, electronic devices, laminates and encapsulations due to the characteristics of outstanding mechanical and electrical properties, relatively low curing shrinkage, superior adhesion to substrates as well as good thermal, chemical and corrosion resistance [1,2,3,4,5,6,7,8]. Incorporation thermosetting network could add several advantages to the polymer likeofforcyclotriphosphazene instance, it enhancesin thea network thermal, polymer network could add several advantages to the polymer like for instance, it enhances the mechanical and electrochemical properties. And they have poor compatibility withcould epoxyberesin whichtoleads to reduce of phosphorus and nitrogen They have poor compatibility with epoxy resin mechanical properties of composites and limit their application. This technique is similar with that concerning the enveloping microscopic cyclotriphosphazene and organic layer of the epoxy resin matrix This technique is similar with that amounts of matter (solid particles, droplets of liquids, or gas bubbles) in a thin film of polymer which concerning the enveloping microscopic amounts of matter
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