Abstract
A BiCMOS embedded RF-MEMS switch module is demonstrated. The module consists of four main blocks: 1) RF-MEMS switch technology, 2) Switch models for design-kit implementation, 3) High Voltage (HV) generation and digital interface, 4) Flexible packaging. The RF-MEMS switch technology is detailed by focusing on the contact model, especially in the down-state. Electromagnetic (EM) and lumped-element models are demonstrated to integrate into foundry process design kit (PDK). The integrated on-chip HV generation and control circuitries are described. A flexible packaging technique is also introduced to package either standalone switches or circuits with several switches.
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