RF plasma deposition of thin Si xGe yC z:H films using a combination of organometallic source materials

Abstract

Elements of the IV group of periodic table have been strongly present in the fast development of PECVD techniques for the last two decades at least. As a result, deposition technologies of such materials as a-Si:H, a-C:H, mμ-C:H or DLC have been successfully established. What has followed is an ever growing interest in binary systems of the A x (IV)B y (IV):H kind. One possible way to deposit such systems is to use organosilicon compounds (to deposit Si x C y :H films) or organogermanium compounds (to deposit Ge x C y :H films), as source substances. The present paper reports on a RF plasma deposition of a Si x Ge y C z :H ternary system, using a combination of organosilicon and organogermanium compounds. Thin Si/Ge/C films have been fabricated in a small volume (ca. 2 dm 3) parallel plate RF plasma reactor using, as a source material, a combination of tetramethylsilane (TMS) and tetramethylgermanium (TMG) vapours carried by argon. SEM investigations reveal a continuous compact character of the coatings and their uniform thickness. The elemental composition of the films has been studied using EDX analysis. The results of the analysis show that the elemental composition of the films can be controlled by both the TMG/TMS ratio of the initial mixture and the RF power input. Ellipsometric measurements show good homogeneity of these materials. Chemical bonding in the films has been studied using the FTIR technique. Bandgap calculations have been carried out using ellipsometric data and by applying both the Tauc law and the Moss approach.