RF Micro-Electro-Mechanical Systems Capacitive Switches Using Ultra Thin Hafnium Oxide Dielectric

Abstract

A π-type RF capacitive switch using about 45-nm-thick HfO2 dielectric layer was fabricated. High isolation performance was obtained in wide-band range when the switch was down-state. The isolation was better than -40 dB at the frequency range of 4–35 GHz. Particularly, the isolation was better than -50 dB in the frequency range of 8–12 GHz, i.e., X band. HfO2 showed excellent process compatibility with conventional microfabrication procedure. The 45-nm-thick HfO2 film was prepared using sputtering at room temperature so that it was feasible to be integrated into RF switch and other microwave circuits. The results of constant bias stressing showed that the ultra thin HfO2 had excellent reliability. The electric breakdown of HfO2 was observed, which had no apparent negative effects on the reliability of the dielectric. HfO2 dielectrics were attractive in the application of RF micro-electro-mechanical systems (MEMS) switch for new generation of low-loss high-linearity microwave circuits.