Abstract

RF (Radio Frequency) MEMS (Micro Electro Mechanical Systems) technology is the application of micromachined mechanical structures, controlled by electrical signals and interacting with signals in the RF range. The applications of these devices range from switching networks for satellite communication systems to high performance resonators and tuners. RF MEMS switches are the first and foremost MEMS devices designed for RF technology. A specialized method for fabricating microsturctures called surface micromachining process is used for fabricating the RF MEMS switches. Die level packaging using available surface mount style RF packages. The packaging process involved the design of RF feed throughs on the Alumina substrates to the die attachment, wire bonding and hermetic sealing using low temperature processes.

Highlights

  • Due to the reduced size, cost and low power consumption as well as very high precision, MEMS applications have extended from mere pressure and temperature sensors to vast array of applications viz., Aerospace, Automobile, Biotechnology, Consumer products, Defense and the most important and pertinent Telecommunications [1]

  • RF MEMS switches are the first and foremost MEMS devices designed for RF technology

  • RF MEMS switches compared to their semiconductor counterparts such as FET and PIN diodes show far superior performance

Read more

Summary

Introduction

Due to the reduced size, cost and low power consumption as well as very high precision, MEMS applications have extended from mere pressure and temperature sensors to vast array of applications viz., Aerospace, Automobile, Biotechnology, Consumer products, Defense and the most important and pertinent Telecommunications [1]. Micro fabrication or micromachining or micro manufacturing is the use of a set of manufacturing tools based on thin and thick film fabrication techniques commonly used in the electronics industry It is a technology for creating small three dimensional structures with dimensions ranging from sub centimeters to sub micrometers. A vast majority of MEMS structures are fabricated using bulk micromachining process. This involves etching of bulk wafer leading to three dimensional structures such as beams, cantilevers and cavities. There are several challenges involved in the fabrication of MEMS switches such as, structural deformation, residual stress, non-release of structural layer to name a few These challenges are overcome and addressed throughout the fabrication process by optimization of several unit processes. The unit processes used is discussed in each section of this chapter

Fabrication process steps
Cleaning of test wafer The cleaning of the
Oxidation of test wafer The oxidation of
Sacrificial layer deposition and patterning
Top layer deposition and patterning
Top layer release
Packaging of RF MEMS shunt capacitive switches
Die level packaging
Dicing of wafer
Design of RF feed throughs on Alumina substrate
Contact free material processing
Attachment of base package to alumina substrate
Die bonding
Wire bonding
Conclusions
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call