Abstract
The author, Mike Harris was a principal research engineer, division chief, and associate director in the Electro-Optical Systems Laboratory at Georgia Technical Research Institute. He has 40 years experience in semiconductor materials and device technology. He developed semiconductor processes for gallium nitride (GaN) high-electron-mobility transistors (HEMTs) and gallium arsenide (GaAs) pseudomorphic HEMTs (pHEMTs). The second author, Rick Sturdivant, has industry experience designing products for microwave and millimeter-wave systems. He developed the world’s first array module for phased-array radar. He is currently president of Microwave Packaging Technology, Inc. This book focuses on RF application-specific integrated circuit chip set design for active electronically scanned arrays (AESAs) for radar and communication applications in both transmit and receive modules. It condenses 30 years of applied research and development of RF front-end technologies. T/R modules technology topics covered in the text include an introduction to phased arrays in radar and communication systems, T/R modules, and module components; monolithic microwave integrated circuits (MMICs); T/R module packaging; RF interconnect materials; thermal management for T/R modules, and MMICs; T/R module manufacturing and testing; module costs; and next-generation T/R modules.
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