RF and optical packaging in telecommunications and other applications

Abstract

This chapter will review many packaging techniques as they relate to RF and optical MEMS devices. The author will try to point out the specific MEMS-related issues and, where they exist, possible solutions to MEMS packaging problems. The discussion of RF MEMS packaging begins with a brief look at a typical RF system architecture and by reviewing the basic materials and techniques used in RF packaging. It then examines areas that are unique to RF MEMS such as: wafer level encapsulation, construction of transmission lines using typical micromachining techniques, and intrachip (device to device) interconnect. The discussion of optical MEMS packaging begins with a brief look at a typical electro-optic system architecture. Basic techniques used in optical device packaging are reviewed, as well as areas that are specifically related to optical MEMS, including: MEMS-based fibre alignment, component assembly and alignment, flip-chip transfer, and other novel techniques. Included in the text are some commercial examples of MEMS packaging. The final section examines the need for computer simulation to support the complex job of co-designing a MEMS component and its package.