Revisiting a Cu-rich layer on the aluminum surface after twin-jet electropolishing

Abstract

Twin-jet electropolishing (TJE) is a well-known method to prepare Cu-containing Al alloys for transmission electron microscopy (TEM) observation. Previous studies have reported a Cu-rich layer usually formed between Al matrix and outermost alumina layer at the electropolished Al surface. However, characteristics and formation mechanisms of the Cu-rich layer remain largely unexplored. Herein, configurations, formation process and property of the Cu-rich layer formed during TJE of Al alloys are revealed detailly employing aberration-corrected scanning TEM (STEM), STEM image simulations and first-principles calculations. The results reveal a new orientation relationship between the Cu-rich layer (θ’-Al2Cu) and Al matrix, which produces a low interfacial Al strain field. Formations of ∼2-nm-thick θ’ layer and its beneath ∼6-nm-thick Cu diffusion zone at the electropolished Cu-containing Al surface are mainly associated with traces of Cu in the electrolyte and anodization. Selective oxidation of elements, Cu-emitting alumina layer and spontaneous solute Cu segregation at the Al surface are also responsible for formations of the θ’ layer and Cu diffusion zone. Further study reveals that the θ’ layer behaves a strong self-healing ability after damaged by high-energy electron beam. The obtained results provide a potential insight into the surface modification of metals and alloys using electrochemical method.