Abstract
Abstract Copper alloys and copper matrix composites have been attracting a lot of attention lately. Their composition design, preparation, and processing directly affect the final performance. In this review, several typical copper alloys, such as Cu-Fe-P, Cu-Ni-Si, and Cu-Cr-Zr are analyzed. The deformation mechanisms, microstructure evolution, and dynamic recrystallization behavior are summarized. In addition, dispersion strengthened copper matrix composites and graphene reinforced copper matrix composites are reviewed.
Highlights
Copper alloys and copper matrix composites have been attracting a lot of attention lately
The strength of pure copper is low at room and high temperatures
Dispersion strengthened copper matrix composites have been widely used in the electronics industry as high voltage switches and resistance welding electrodes due to their excellent high-temperature strength, high electrical and thermal conductivity [65,66,67,68]
Summary
Abstract: Copper alloys and copper matrix composites have been attracting a lot of attention lately. Copper alloys and copper-based composites prepared through various strengthening mechanisms have high electrical and thermal conductivity, and high strength and plasticity, along with good processing performance [4,5,6,7,8,9]. The scattering effect of electrons on solute atoms in the copper matrix is greater than that caused by the secondary phase, so dispersion strengthened copper matrix composites can enhance the material strength while ensuring the electrical conductivity. The deformation mechanisms, microstructure evolution and its effects on the alloys’ properties, along with dynamic recrystallization and aging precipitation mechanisms of several typical copper alloys and copper-based composites during the thermal processing are reviewed
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