Abstract

This paper reviews the brittle fracture behavior of dielectric ceramics such as barium titanate, and describes some of the relationships between defects such as cracks and electrical degradation and failure of multilayer capacitors. Stresses arising from the ferroelectric phase transformation in these dielectric materials are shown to play a part as a driving force for crack growth. In addition, possible contributions to failure from stresses arising from thermal excursions in the capacitor are discussed. Low‐voltage failures arising from a short between the electrodes in multilayer capacitors are shown to be related to the growth of cracks in the dielectric. A technique for predicting the onset of these types of failures based upon fracture mechanics techniques is described. Possible effects of the electric field itself in promoting or retarding the growth of cracks are discussed.

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