Abstract
AbstractThe ASTM E42.08 subcommittee on ion beam sputtering has sponsored a round robin to measure the sputter yield of anodic Ta2O5 films grown on tantalum. The purpose of this study was to compare the results from different laboratories and to test the suitability of this material as a standard for sputter yield measurements. Six different laboratories made 42 separate measurements of the sputter yield of Ta2O5 by determining the time to the Ta2O5/Ta interface during Auger depth profiles using 2 ke V Ar+ ions. The scatter of an individual set of measurements varied from 3 to 6% (except for one laboratory) while the means of the individual set of measurements varied about 10% from the average of all of the measurements. This result indicated the presence of systematic errors among the various laboratories. The possible sources of these errors are discussed.
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