Abstract

Thermal conduction processes at shocked material interfaces are studied. A contact resistance model has been developed in order to understand the histories of interface temperatures following shock compression. It is demonstrated that the thermal relaxation processes at the shocked interfaces are restrained by the relaxation time constant which is proportional to the square of the contact resistance. The model is also applied to explain some previous experiments about determining shock temperatures of opaque materials from the thermal radiation transmitted through transparent windows. When the relaxation time constant is less than one half of the time resolution of the system for measurement of the thermal radiation history, the relaxation phenomena at the shocked interfaces cannot be observed.

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