Abstract
The prototypes were built in a very advanced industrial fabrication lab, where the process steps were closely followed. These steps include drilling, via electroplating, surface finishing, and milling the dielectric superstrate. The fabrication cost can be high, mainly because of the DRA milling on board. An obvious solution for larger arrays is to form smaller antenna substrate, which leads to less milling (or even no milling). The large-scale 2D SIW-DRA array in the paper. To significantly lower the fabrication cost, the process is somewhat simplified without losing its generality. Process step can be ignored when the DRA elements are formed (milled) off the SIW board precisely, then glued (bonded). This process was used to fabricate the 2D array at a university lab. The DRA blocks were glued to their positions with the help of an aligning board. Sometimes, DRAs fall off the board during radiation pattern measurement and have to be glued back to their positions.
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